EPOFIL 60 D-20

EPOFIL 60 D-20 is filled, solvent free, RoHS compliant Epoxy Compound. It is formulated and processed to obtain void free casting, potting and encapsulated components. It is ready to use filled system having low viscosity at processing temperature. It is slow curing system with low exotherm.

The General-purpose Epoxy Potting Compounds when cured with Polyamine or Polyamide Hardeners cures to very hard mass with surface hardness of Shore D 80 and above. This cure will have good mechanical properties but the thermal cycling is very poor which leads to component failure due to stresses developed. That is why this product EPOFIL 60 D-20 is developed and recommended for better thermal cycling properties

The cured compound has :

  • Excellent Flexibility
  • Increased thermal conductivity
  • Good Adhesion
  • Good Mechanical and Electrical Properties
  • Reduced shrinkage and exotherm
  • Low coefficient of linear thermal expansion and less thermal stresses
  • Suitable for Class F temp (155°C)
  • Suitable for working temp - 30°C to 150°C
  • Shrinkage < 0.1 %
  • Can be used for SMD electronic potting
  • RoHS compliance


EPOFIL 60 D-20 is suitable for Casting, Potting and Sealing of small and medium sized electrical and electronic components.

EPOFIL 60 D-20 is recommended where large degree of thermal cycling is expected.