Epoxy Resin 520 is a solvent less Epoxy Resin which in combination with various types of hardners (Room temperature curing and heat curing) cures in hard mass.

Epoxy Resin 520 is characterized by

  • Low Viscosity
  • Long Pot life
  • Good mechanical & electrical properties


  • Epoxy Resin 520 is suitable for casting, potting and encapsulation of electrical and electronic components such as switch gears bushing, current and voltage transformers, bus bar support assembly. Due to fast gelling behavior at high temperature TAB systems is ideally suitable for manufacturing of casting by pressure gelation technique.
  • Recommended for Glass fiber impregnation / lamination by lay up or pultrusion Technique.