Epofil 60

EPOFIL 60 is a pigmented filled, solvent free, RoHS compliant Epoxy Compound. It is formulated and processed to obtain void free casting, potting and encapsulated components. It is ready to use filled system having low viscosity at processing temperature. It is slow curing system with low exotherm.

The cured compound has :

  • RoHS compliance
  • Good Adhesion to most organic and inorganics materials
  • Good Mechanical and Electrical Properties
  • Reduced shrinkage and exotherm.
  • Low coefficient of linear thermal expansion.
  • Suitable for Class F temp (155°C)
  • Shrinkage 1.5 – 2.0 %


EPOFIL 60 is suitable for Casting, Potting and Sealing of small and medium sized electrical and electronic components.