EPOFIL HC 6016 is filled Epoxy, Solvent free, RoHS Compliance Compound. It is formulated and processed to obtain void free casting, potting and encapsulation components. It has got High thermal conductivity. It is RT curing system with good Electrical and mechanical properties.
The cured material EPOFIL HC 6016 shows good electrical, mechanical and chemical properties. Because of special type of ingredients in the system it gives high Thermal conductivity. System is recommended for Class F - 155°C
EPOFIL HC 6016 is recommended for Potting of Electronics & Electrical components. Encapsulation for Electrical & Electronics components with Higher Thermal Conductivity. A stable product for thermal cycling potting applications.